Presentation
Keynote: The Open Chiplet Economy and its Application to HPC
DescriptionMultiple technological and business trends are driving a change to realizing semiconductor products as systems in package (SiP) that integrate multiple die, usually referred to as chiplets, into a single package. Compared to monolithic SoCs, chiplet-based designs require an evolution in architecture, interfaces, design and manufacturing flows. Several large companies have already made the transition to chiplet-based designs with proprietary tools and technologies. Many have not and need the expertise to do so. A new and open Chiplet economy to help more companies adopt chiplet technologies. It is based on and will require collaboration and standardizations on multiple dimensions, ensuring that companies are able to interact in an open, efficient and scalable manner. This talk will profile the chiplet economy including its motivations, standards, participants and current status. It will close with an overview of the potential relevance of the open chiplet economy to HPC.
